BMF expands portfolio with four new high-performance resins

Boston Micro Fabrication (BMF), an ultra-high precision 3D printing solutions company, has introduced four new materials for its microArch series 3D printers. These advanced materials, including 3D Systems’ Figure 4 HI TEMP 300-AMB, BASF Ultracur3D 3280, and BMF resins HTF and SR, further enhance BMF’s ability to meet the diverse and demanding needs of industries like aerospace, medical devices, electronics, and biotechnology. By adding these advanced materials to the lineup, BMF is enabling engineers and researchers to create fit-for-purpose precision parts with unprecedented accuracy, heat resistance, and material performance.

Ideal for extreme thermal environments, this production-grade, ultra-high temperature resistant plastic offers a Heat Deflection Temperature (HDT) of over 300°C. With excellent rigidity and visualization properties, Figure 4 HI TEMP 300-AMB is perfect for HVAC components, motor enclosures, and low-pressure molding, offering precise testing of high-temperature parts.

Applications include HVAC systems, consumer appliances, motor enclosures, and low-pressure molding, and key benefits include HDT over 300°C, no secondary thermal post-cure required, and superior rigidity.

A ceramic-filled resin that boasts exceptional stiffness (Young’s modulus of 10 GPa) and a high Heat Deflection Temperature (>280°C), Ultracur3D 3280 is ideal for tooling, molding, and wind tunnel testing. Its low viscosity and stable suspension make it both easy to handle and print, positioning it as a standout material in the field of high-temperature and high-stiffness applications.

Applications include tooling, wind tunnel testing, and mold inserts, and key benefits include superior stiffness and temperature performance, high stability, and ease of printing.

Designed by BMF, HTF is a high-temperature resistant, tough, and biocompatible resin. It is autoclave-sterilizable and ideal for applications where biocompatibility and flexibility are key. With an HDT of 152°C and compatibility with aerospace and biotech applications, HTF offers versatility across a range of demanding environments.

Applications include aerospace, precision electronics, and biotechnology, and key benefits include biocompatibility, autoclave sterilizable, and higher flexibility than comparable materials.

A soluble, sacrificial material, SR enables the creation of single-use molds for parts produced with other materials that cannot be easily printed, such as polypropylene (PP) or polyoxymethylene (POM). This material opens new possibilities for prototyping and low-volume production by reducing the cost and complexity of micro-injection molding.

Applications include single-use molds, low-volume part production, and PDMS applications, and key benefits include dissolving in a sodium hydroxide solution and facilitating cost-effective part production.

“Before discovering BMF, Makuta struggled to find a cost-effective solution for prototyping due to the size and complexity of their molded parts. Traditional methods like aluminum or urethane molds often fell short in holding the required tolerances, and the expense of creating entirely new molds was prohibitive. Using BASF Ultracur3D 3280 on BMF’s microArch system, we were blown away by the impeccable finish and precision of the first 3D printed mold inserts we received. Not only were they able to reproduce intricate features flawlessly, but they also maintained the tight tolerances our projects demand,” said Taki Yamada, Director of Business Development at Makuta.

“Boston Micro Fabrication’s micro-precision 3D printing technology has completely transformed how we approach connector manufacturing. Previously limited to tolerances of 5 thousandths with traditional methods, BMF allowed us to achieve tolerances of 1 to 2 thousandths, opening new possibilities for compact, high-performance connectors. Their platform also enabled us to use 3D Systems Figure 4 HI TEMP 300-AMB material that can withstand temperatures up to 300°C, meeting the demands of standard electronic assembly processes, enhancing efficiency, and allowing us to create more compact, innovative designs. With BMF, we’ve reduced time and costs while delivering precision and performance that surpass industry standards,” said George Glatts, Owner of Z-Axis Connector Company.